CEFM101-G Datasheet | Comchip Technology

Features : Ideal for surface mount applications Easy pick and place Plastic package has Underwriters Lab. flammability classification 94V-0. Built-in strain relief Super fast recovery time for high efficient Low forward voltage drop 0.110 (2.80) 0.094 (2.40) 0.071 (1.80) 0.055 (1.40) MINI SMA 0.161 (4.10) 0.146 (3.70) 0.012 (0.30) Typ. Mechanical Data: Case: Mini-SMA/SOD-123 molded plastic Terminals: solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Mounting position: Any Approx. Weight: 0.04 gram 0.063 (1.60) 0.055 (1.40) 0.035 (0.90) Typ. 0.035 (0.90) Typ. Dimensions in inches and (millimeter) Maximum Ratings and Electrical Characterics: Parameter Max. Repetitive Peak Reverse Voltage Max. DC Blocking Voltage Max. RMS Voltage Peak Surge Forward Current 8.3ms single half sine-wave superimposed on rate load (JEDEC method) Max. Average Forward Current Max. Instantaneous Forward Voltage at 1.0A Reverse recovery time Max. DC Reverse Current at Rated DC Blocking Voltage Ta=25o C Ta=100o C Max. Thermal Resistance (Note1) Max. Operating Junction Temperature Storage Temperature Symbol CEFM101-G 50 50 35 CEFM102-G CEFM103-G CEFM104-G CEFM105-G 100 100 70 200 200 140 400 400 280 600 600 420 Unit V V V VRRM VDC VRMS IFSM Io VF Trr IR R 1.0 0.875 25 1.1 35 1.25 50 A V n S u A o C/W o o 5.0 250 42 -55 to +155 -55 to +150 Tj TSTG Note1: Thermal resistance from junction to lead P.C.B. Mounted on 8.0x8.0 mm copper pad areas. “-G” suffix designates Ro HS pliant Version .chiptech. Page1 SMD Efficient Fast Recovery Rectifier Rating and Characteristic Curves (CEFM101-G thru CEFM105-G) Fig. 1 - Reverse Characteristics Fig.2 - Forward Characteristics CEFM101-G-103-G Forward Current (A) Tj=125 C Reverse current (u A) CEFM104-G Tj=75...