CURC307-G Datasheet | Comchip Technology

SMD Ultra Fast Reco ver y Rect ifier s CHIP SMD Diodes Specialist CURC301-G Thru. CURC307-G Reverse Voltage: 50 to 1000 Volts Forward Current: 3.0 Amp Ro HS Device Features -Ideal for surface mount applications. -Easy pick and place. -Plastic package has Underwriters Lab. flammability classification 94V-0. -Fast recovery time: 50~75n S. -Low leakage current. 0.280(7.11) 0.260(6.60) DO-214AB (SMC) 0.124(3.15) 0.108(2.75) 0.245(6.22) 0.220(5.59) Mechanical data -Case: JEDEC DO-214AB, molded plastic. -Terminals: solderable per MIL-STD-750, method 2026. -Polarity: Color band denotes cathode end. -Approx. weight: 0.21 grams 0.103(2.62) 0.079(2.00) 0.320(8.13) 0.305(7.75) 0.012(0.31) 0.006(0.15) 0.050(1.27) 0.030(0.76) 0.008(0.20) 0.004(0.10) Dimensions in inches and (millimeter) Maximum Ratings and Electrical Characteristics Parameter Max. repetitive peak reverse voltage Max. DC blocking voltage Max. RMS voltage Peak surge forward current, 8.3ms single half sine-wave superimposed on rate load (JEDEC method) Max. average forward current Max. instantaneous forward voltage at 3.0A Reverse recovery time Max. DC reverse current at T A =25 OC rated DC blocking voltage T A =125 OC Symbol V RRM V DC V RMS CURC 301-G 50 50 35 CURC 302-G 100 100 70 CURC 303-G 200 200 140 CURC 304-G 400 400 280 CURC 305-G 600 600 420 CURC 306-G 800 800 560 CURC 307-G 1000 1000 700 Units V V V I FSM IO VF T rr IR RθJL TJ T STG 1.0 50 3.0 1.3 1.7 75 5.0 150 20 150 -55 to +150 A V n S μA C/W .. Max. thermal resistance (Note 1) Max. operating junction temperature Storage temperature Notes: 1. Thermal resistance from junction to lead mounted on P.C.B. with 8.0×8.0 mm 2 square land...