CZRB3014 Datasheet | Comchip Technology

Features - For surf ace mounted applications in order to optimize board space - Low profile package - Built-in strain relief - Glass passivated junction - Low inductance - Excellent clamping capability - Typical ID less than 1u A above 11V - High temperature soldering 260°C /10 seconds at terminals - Plastic package has underwriters laboratory flammability classification 94V-O SMB/DO-214AA 0.083(2.11) 0.075(1.91) 0.185(4.70) 0.160(4.06) 0.155(3.94) 0.130(3.30) 0.012(0.31) 0.006(0.15) 0.096(2.44) 0.083(2.13) 0.050(1.27) 0.030(0.76) 0.008(0.20) 0.203(0.10) 0.220(5.59) 0.200(5.08) Mechanical data - Case: JEDEC DO-214AA, Molded plastic over passivated junction - Terminals: Solder plated, solderable per MILSTD-750, method 2026 - Polarity: Color band denotes positive end (cathode) except Bidirectional - Standard Packaging: 12mm tape (EIA-481) - Weight: 0.002 ounce, 0.064 gram Dimensions in inches and (maillimeter) Maximum Ratings and Electrical Characterics Ratings at 25°C ambient temperature unless otherwise specified. Rating Peak Pulse Power Dissipation (Note A) Derate above 75 Peak forward Surge Current 8.3ms single half s ine-wave superimposed on rated load (JEDEC Method) (Note B) Operating Junction and Storage Temperature Range Symbol PD IFSM TJ,TSTG Value 3 24 15 -55 to +150 Units Watts m W/°C Amps °C MDS0 303002 A Page 1 Surface Mount Zener Diode ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) (V F=1.2Volts Max, IF=500m A for all types.) CHIP .chip..tw Device (Note 1.) Nominal Zener Voltage VZ @ IZT (Note 2.) (Volts) Test current IZT (m...