CZRC5351 Datasheet | Comchip Technology

Features For surface mounted applications in order to optimize board space Low profile package Glass passivated junction Low inductance Built-in strain relief High temper ature soldering :260 °C /10 seconds at terminals SMC/DO-214AB 0.124(3.15) 0.108(2.75) 0.280(7.11) 0.260(6.60) 0.245(6.22) 0.220(5.59) Mechanical data 0.103(2.62) 0.079(2.00) 0.012(0.31) 0.006(0.15) Case: JEDEC DO -214AB Molded plastic over passivated junction Terminals: Solder plated, solderable per, MIL-STD-750, method 2026 Standard Packaging: 16mm tape(EIA- 481) Weight: 0.007 ounce, 0.21 gram 0.050(1.27) 0.030(0.76) 0.320(8.13) 0.305(7.75) 0.008(0.20) 0.0203(0.10) Dimensions in inches and (millimeter) Maximum Ratings and Electrical Characterics Ratings at 25°C ambient temperature unless otherwise specified. DC Power Dissipation @ TL=75°C, Measure at Zero Lead Length(Fig. 1) Derate above 75°C (Note 1) Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) (Note 1,2) Operating Junction and Storage Temperature Range SYMBOL PD VALUE 5.0 40.0 UNITS Watts m W/°C IFSM TJ,TSTG See Fig. 5 Amps -55 to +150 °C NOTES: 1. Mounted on 8.0mm copper pads to each terminal. 2. 8.3ms single half sine-wave, or equivalent square wave, duty cycle = 4 pulses per minute maximum. MDS021101 3 A Page 1 Surface Mount Zener Diode Nominal Zener Voltage VZ @ IZT volts (Note 2.) 11 12 13 14 15 16 17 18 19 20 22 24 25 27 28 30 33 36 39 43 47 51 56 60 62 68 75 82 87 91 100 110 120 130 140 150 160 170 180 190 200 Maximum Zener Impedance Z @ IZK ZZT @ IZT ZK = 1 m A Ohms Ohms (Note 2.) (Note 2.) 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 3 3 3.5 3.5 4 5 6 8 10 11 14 20 25 27 35 40 42 44 45 65 75 75 90 125 170 190 230 330 350 380 430 450 480 125 125 100 75 75 75 75 75 75 75 75 100 110 120 130 140 150 160 170 190 210 230 280 350 400 500 620 720 760 760 800 1000 1150 1250 1500 1500 1650 1750 1750 1850 1850 Max reverse Leakage Current @ VR Volts IR u A 5 2 1 1 1 1 0.5 0.5 0.5 0.5 0.5 0.5...