HC2LP - HIGH CURRENT 2LP Low Profile Power Inductors

Cooper Bussmann

General Description

RoHS 2002/95/EC Compact footprint for high density, high current/low voltage applications Foil technology that adds higher reliability f actor over the traditional magnet wire used for higher frequency circuit designs Frequency Range up to 1MHz Ferrite core ma

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Datasheet Details

Part number	HC2LP
Manufacturer	Cooper Bussmann
File Size	246.79 KB
Description	HIGH CURRENT 2LP Low Profile Power Inductors
Datasheet	HC2LP Datasheet

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HIGH CURRENT 2LP Low Profile Power Inductors Description RoHS 2002/95/EC • Compact footprint for high density, high current/low voltage applications • Foil technology that adds higher reliability f actor over the traditional magnet wire used for higher frequency circuit designs • Frequency Range up to 1MHz • Ferrite core material Applications • Next generation microprocessors • Energy storage applications • DC-DC converters • Computers Environmental Data • Storage temperature range: -40°C to +125°C • Operating ambient temperature range: -40°C to +85°C (range is application specific). • Solder reflow temperature: +260°C max. for 10 seconds max. Part Number HC2LP-R47-R HC2LP-R68-R HC2LP-1R0-R HC2LP-2R2-R HC2LP-4R7-R HC2LP-6R0-R Rated Inductance µH .47 .68 1.0 2.2 4.7 6.0 OCL (1) µH ± 20% .