FFM106-M
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Tiny plastic SMD package.
- High current capability.
- Fast switching for high efficiency.
- High surge current capability.
- Glass passivated chip junction.
- Lead-free parts meet RoHS requirments.
- Suffix "-H" indicates Halogen-free parts, ex. FFM101-M-H. Package outline SOD-123
- 154(3.9) 0.138(3.5)
