KBU808
Features
High surge current capability Ideal for printed circuit board Reliable low cost construction technique results in inexpensive product High temperature soldering guaranteed: 260℃ / 10 seconds / 0.375” ( 9.5mm ) lead length at 5 lbs., ( 2.3 kg ) tension Weight: 8 grams
.220(5.6) .177(4.5)
.052(1.3) .047(1.2)
.280(7.1) .259(6.6)
.220(5.6) .181(4.6)
Absolute Maximum Ratings-
Symbol
IO if(surge) PD RθJA RθJL Tstg TJ Average Rectified Current @ TA = 50°C Peak Forward Surge Current
TA = 25°C unless otherwise noted
Parameter
Value
8.0 300 6.9 55 18 3.0 -55 to +150 -55 to +150
.090(2.3) .066(1.7)
.1.0(25.4)MIN
Units
A A W m W/°C °C/W °C/W °C °C
Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Ambient,-
- per leg Thermal Resistance, Junction to Lead,-
- per leg Storage Temperature Range Operating Junction Temperature
- These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
- - Device mounted on PCB...
