Description
Note Active die size: X = 75.0 mils / 1907 μm Y = 56.2 mils / 1428 μm Scribe: Y (horizontal) = 2.8 mils / 71 μm X (vertical) = 3.4 mils / 86.2 μm Bond pad opening: 85 μm x 85 μm Pad pitch: 125 μm x 125 μm (pad center to pad center) Wafer thickness: 11 mils and 29 mils TYPICAL (See Ordering Informat
Features
- Benefits.
- Flash programmable die for in-package programming of crystal oscillators High resolution phase-locked loop (PLL) with 10-bit multiplier and 7-bit divider Flash programmable capacitor tuning array Simple 2-pin programming interface (excluding VDD and VSS pins) On-chip oscillator used with external 25.1 MHz fundamental tuned crystal Flash programmable spread spectrum with spread percentages between +0.25% and +2.00% Spread spectrum o.
CY5057 Datasheet
