CY5057 Overview
X = 75.0 mils / 1907 μm Y = 56.2 mils / 1428 μm Scribe: Y (horizontal) = 2.8 mils / 71 μm X (vertical) = 3.4 mils / 86.2 μm Bond pad opening: 125 μm x 125 μm (pad center to pad center) Wafer thickness:.
CY5057 Key Features
- Benefits
- Flash programmable die for in-package programming of crystal oscillators High resolution phase-locked loop (PLL) with 10
- 5 to 170 MHz at 3.3V ± 10% Seven-bit linear post divider with divide options from divide-by-2 to divide-by-127 Programma