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BU-61570 - Bus Controller / Remote Terminal / Monitor Terminal - BC/RT/MT

This page provides the datasheet information for the BU-61570, a member of the BU-61580 Bus Controller / Remote Terminal / Monitor Terminal - BC/RT/MT family.

Datasheet Summary

Description

DDC's BU-65170, BU-61580 and BU-61585 Bus Controller / Remote Terminal / Monitor Terminal (BC/RT/MT) A d v a n c e d Communication Engine (ACE) terminals comprise a complete integrated interface between a host processor and a MIL-STD-1553 A and B or STANAG 3838 bus.

Features

  • Fully Integrated MIL-STD-1553 Interface Terminal Interface.
  • Flexible Processor/Memory.
  • Standard 4K x 16 RAM and.
  • Optional RAM Parity Optional 12K x 16 or 8K x 17 RAM Available Generation/Checking.
  • Automatic BC Retries.
  • Programmable BC Gap Times.
  • BC Frame Auto-Repeat.
  • Flexible RT Data Buffering.
  • Programmable Illegalization.
  • Selective Message Monitor.
  • Simultaneous RT/Monitor Mode TX/RX_A SHARED.

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Datasheet preview – BU-61570

Datasheet Details

Part number BU-61570
Manufacturer DDC
File Size 668.57 KB
Description Bus Controller / Remote Terminal / Monitor Terminal - BC/RT/MT
Datasheet download datasheet BU-61570 Datasheet
Additional preview pages of the BU-61570 datasheet.
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Full PDF Text Transcription

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BU-65170/61580 and BU-61585 MIL-STD-1553A/B NOTICE 2 RT and BC/RT/MT, ADVANCED COMMUNICATION ENGINE (ACE) ACE User’s Guide Also Available DESCRIPTION DDC's BU-65170, BU-61580 and BU-61585 Bus Controller / Remote Terminal / Monitor Terminal (BC/RT/MT) A d v a n c e d Communication Engine (ACE) terminals comprise a complete integrated interface between a host processor and a MIL-STD-1553 A and B or STANAG 3838 bus. The ACE series is packaged in a 1.9 square-inch, 70-pin, low-profile, cofired MultiChip Module (MCM) ceramic package that is well suited for applications with stringent height requirements. The BU-61585 ACE integrates dual transceiver, protocol, memory management, processor interface logic, and a total of 12K words of RAM in a choice of DIP or flat pack packages.
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