DB806 Datasheet | DIOTEC Electronics Corporation

Features VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 400 AMPS PEAK SERIES DB800-DB810 and ADB804-ADB808 y Az {A| UL RECOGNIZED - FILE #E124962 Ro HS PLIANT MECHANICAL DATA Case: Molded Epoxy (UL Flammability Rating 94V-0) Terminals: Round silver plated copper pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case; positive lead at beveled corner Mounting Position: Any. Through hole provided for #6 screw Weight: 0.18 Ounces (5.4 Grams) SYM BL BH D1 LL MILLIMETERS MIN _ + LD D1 INCHES + D1 _ BL 6.4 12.2 MAX 19.6 7.6 13.2 0.73 0.25 0.48 MAX 0.77 0.3 0.52 22.2 1.2 n/a 1.3 0.875 0.048 n/a 0.052   ¡ ¢ £ ¤ - ¦- ¡ ¢ ¨ ©- ¡ £ ¤ ¢ ¢ ¡ ¢ ! ¤ " ¦ ¦- # ¢ $ %&£ ¦ - ¦ ' £ ( £ ) 0 1 £ ¤ - " $ ¡ ¦ 2 $ ¡ " ( %3¡ 4 2 5 6 7 8 2 ¦ £ ¦ ¢ £ 4 - # £ ¤ ) ' ¢ £ 4 !" # ¡ ) 0 9 # ' ¡ ¡ ' £ ¢ £ 4 !" # ¡ ) ¦ 2 ) ¡ ¢ - ' ¤ ¢@ A- ¨ 6 B0 MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS PARAMETER (TEST CONDITIONS) Series Number Maximum DC Blocking Voltage Working Peak Reverse Voltage Maximum Peak Recurrent Reverse Voltage RMS Reverse Voltage Power Dissipation in V Ù ÚYÛfÜ Ý SYMBOL މßáàâYãäßáådåfæèç éYêfé‡ëé‡ìäíïî‰ð RATINGS ñ...