MR2400FR Datasheet | Diotec Semiconductor

FEATURES VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot MECHANICAL SPECIFICATION D5 D3 f P D1 HIGH Frequency: 250 k Hz FAST Recovery: 100n S - 150n S Unmatched Performance - Minimal RFI/EMI, Reduced Power Losses, Extremely Cool Operation Increased Power Supply Efficiency D D4 D2 MECHANICAL DATA B1 B2 12 B3 A1 Structure: Epoxy encapsulated diode body with metal tabs Finish: All external surfaces are corrosion resistant and PIN 1 CATHODE PIN 2 ANODE readily solderable Maximum Soldering Temperature: 250 o C 3/8“ from case for 10 seconds Mounting: Lead or chassis mounted, same configuration as TO-220AB Mounting Torque: 8 in-lbs Max....