MR2401 Datasheet | Diotec Semiconductor

FEATURES Suggested Alternative For The MR2400, MR2401, MR2402, MR2404, MR2406 Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance High Heat Handling Capability With Very Low Thermal Stress Proprietary Junction Passivation For Superior Reliability And Performance Low Forward Voltage Drop MECHANICAL DATA Structure: Epoxy encapsulated diode body with metal tabs PIN 1 CATHODE PIN 2 ANODE Finish: All external surfaces are corrosion resistant and readily solderable Maximum Soldering Temperature: 250 o C 3/8“ from case Ro HS PLIANT for 10 seconds Mounting: Lead or chassis...