MR2406R Datasheet | Diotec Semiconductor

FEATURES Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance High Heat Handling Capability With Very Low Thermal Stress Proprietary Junction Passivation For Superior Reliability And Performance Low Forward Voltage Drop MECHANICAL DATA Structure: Epoxy encapsulated diode body with metal tabs Finish: All external surfaces are corrosion resistant and readily solderable o Maximum Soldering Temperature: 250 C 3/8“ from case Ro HS PLIANT for 10 seconds Mounting: Lead or chassis mounted, same configuration as TO-220AB Mounting Torque: 8 in-lbs Max. Polarity: Cathode to Front Tab Weight: 1.2 Ounces (3.6 Grams), approximately MAXIMUM...