MR2504
FEATURES
MECHANICAL SPECIFICATION
Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
Large Die For High Power Heavy Duty Performance
High Heat Handling Capability With Very Low Thermal Stress
Proprietary Junction Passivation For Superior Reliability And Performance
Low Forward Voltage Drop
Die Size: 0.160" x 0.160"
Square
Color Ring Denotes Cathode
MECHANICAL DATA
Case: Molded Epoxy (UL Flammability Rating 94V-O) Finish: All external surfaces are corrosion resistant and the contact areas are readily solderable Soldering Temperature: 265 o C maximum Mounting Position: Any
A B D F M
MILLIMETERS
INCHES
MIN 9.78
MAX 10.29
5° NOM
MIN MAX 0.385 0.405 0.235 0.250 0.215 0.225 0.165 0.175
5° NOM
Polarity: Color band denotes cathode Weight: 0.6 Ounces (1.8 Grams)
Ro HS PLIANT
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient...
