MR2510 Datasheet | Diotec Semiconductor

FEATURES MECHANICAL SPECIFICATION Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Large Die For High Power Heavy Duty Performance High Heat Handling Capability With Very Low Thermal Stress Proprietary Junction Passivation For Superior Reliability And Performance Low Forward Voltage Drop Die Size: 0.160" x 0.160" Square Color Ring Denotes Cathode MECHANICAL DATA Case: Molded Epoxy (UL Flammability Rating 94V-O) Finish: All external surfaces are corrosion resistant and the contact areas are readily solderable Soldering Temperature: 265 o C maximum Mounting Position: Any A B D F M MILLIMETERS INCHES MIN 9.78 MAX 10.29 5° NOM MIN MAX 0.385 0.405 0.235 0.250 0.215 0.225 0.165 0.175 5° NOM Polarity: Color band denotes cathode Weight: 0.6 Ounces (1.8 Grams) Ro HS PLIANT MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS Ratings at 25 °C ambient temperature unless otherwise specified. PARAMETER (TEST CONDITIONS) SYMBOL RATINGS UNITS Series Number Maximum DC Blocking Voltage Maximum RMS...