HBS810
Key Features
- Surface mount bridge, small package
- Ideal for printed circuit boards
- Glass passivated chip junction
- High forward current capability up to 8.0A
- High surge current capability
- High heat dissipation capability
- Low profile package
- Low forward voltage drop
- Plastic package has Underwrites Laboratory Flammability Classification 94V-0; Case：HBS RoHS PLIAN Mechanical Data
- Case: HBS; Epoxy meets UL-94V-0 Flammability rating
