• Part: DP3S1MX32PY5
  • Manufacturer: DPAC Technologies
  • Size: 1.14 MB
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DP3S1MX32PY5 Description

The DP3S1MX32PY5 is a 1M x 32 SRAM module that utilizes the new and innovative space saving TSOP stacking technology. The module is constructed of two 1M x 16 SRAM’ s that are configured as a 1M x 32.

DP3S1MX32PY5 Key Features

  • Organizations Available: 1M x 32
  • Access Times: 10-, 12, 15, 20ns
  • 3.3 ±0.3-- Volt Power Requirement
  • Fully Static Operation
  • No clock or refresh required
  • TTL-patible Inputs and Outputs
  • 80-Pin Surface Mount LP-Stack ™
  • A19 I/O0
  • I/O31 CS WE OE BS0 BS1 BS2 BS3 VDD VSS NU. Address Inputs Data Input/Output Stack Enable Write Enable Output Enable Byte
  • I/O7 Byte Select I/O8