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DIM1000XSM33-TF001 - Single Switch IGBT

Key Features

  • 10.2kV Isolation.
  • 10µs Short Circuit Withstand.
  • High Thermal Cycling Capability.
  • High Current Density Enhanced DMOS SPT.
  • Isolated AlSiC Base With AlN Substrates.
  • Lead Free Construction.

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Datasheet Details

Part number DIM1000XSM33-TF001
Manufacturer DYNEX
File Size 313.98 KB
Description Single Switch IGBT
Datasheet download datasheet DIM1000XSM33-TF001 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Replaces DS6364-2 DIM1000XSM33-TF001 Single Switch IGBT Module DS6364-3 January 2023 (LN42354) FEATURES • 10.2kV Isolation • 10µs Short Circuit Withstand • High Thermal Cycling Capability • High Current Density Enhanced DMOS SPT • Isolated AlSiC Base With AlN Substrates • Lead Free Construction APPLICATIONS • High Reliability Inverters • Motor Controllers • Traction Drives • Choppers The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A. The DIM1000XSM33-TF001 is a single switch 3300V, soft punch through n-channel enhancement mode, insulated gate bipolar transistor (IGBT) module.