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DS21FF42 - 4 X 3 Twelve Channel T1 Framer

Description

The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer.

Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1.

Features

  • P.
  • Sixteen (16) or Twelve (12) Completely Independent T1 Framers in One Small 27mm x 27mm Package.
  • Each Multi-Chip Module (MCM) Contains Four (FF) or Three (FT) DS21Q42 Die. Each Quad Framer Can be Concatenated into a Single 8.192MHz Backplane Data Stream.
  • 1. MULTI-CHIP MODULE (MCM).

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Datasheet preview – DS21FF42

Datasheet Details

Part number DS21FF42
Manufacturer Dallas Semiconducotr
File Size 466.18 KB
Description 4 X 3 Twelve Channel T1 Framer
Datasheet download datasheet DS21FF42 Datasheet
Additional preview pages of the DS21FF42 datasheet.

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Full PDF Text Transcription

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DALLAS SEMICONDUCTOR DS21FT42 / DS21FF42 4 X 3 Twelve Channel T1 Framer 4 X 4 Sixteen Channel T1 Framer • • IEEE 1149.1 JTAG-Boundary Scan Architecture DS21FF42 and DS21FT42 are Pin Compatible with DS21FF44 and DS21FT44, respectively, to allow the Same Footprint to Support T1 and E1 Applications 300–pin MCM BGA package (27mm X 27mm) Low Power 3.3V CMOS with 5V Tolerant Input & Outputs FEATURES P • Sixteen (16) or Twelve (12) Completely Independent T1 Framers in One Small 27mm x 27mm Package • • Each Multi-Chip Module (MCM) Contains Four (FF) or Three (FT) DS21Q42 Die. Each Quad Framer Can be Concatenated into a Single 8.192MHz Backplane Data Stream • • 1.
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