DS21Q554 Overview
The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers. Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1. All of the functions available on the DS21352/DS21552 and DS21354/DS21554 are also available in the...
DS21Q554 Key Features
- Four (4) pletely Independent T1 or E1 Transceivers In One Small 27mm x 27mm Package
- T1 T1 E1 E1