Datasheet4U Logo Datasheet4U.com

DP3ED32MX8RY5 - 3.3V EDO DRAM

Download the DP3ED32MX8RY5 datasheet PDF. This datasheet also covers the DP3ED32MX8RY5-Dense variant, as both devices belong to the same 3.3v edo dram family and are provided as variant models within a single manufacturer datasheet.

General Description

The M-Densus series is a family of interchangeable memory modules.

The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology.

Key Features

  • Configurations Available: 256 Megabit: 32 Meg x 8.
  • Access Times: 50, 60ns (max. ).
  • 3.3 Volt Supply.
  • Common Data Inputs and Outputs.
  • Extended Data Out Capability (EDO).
  • 4K/8K 64ms Refresh.
  • 3 Variations of Refresh: - RAS only Refresh - CAS before RAS Refresh - Hidden Refresh.
  • Package: Leadless TSOP Module A0 - A11 A0 - A12.
  • DQ0 - DQ4 CAS0 - CAS4 RAS0 - RAS4 WE OE VCC VSS N. C. PIN NAMES Row Address: A0 - A11 Column Addre.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DP3ED32MX8RY5-Dense-PacMicrosystems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number DP3ED32MX8RY5
Manufacturer Dense-Pac Microsystems
File Size 110.86 KB
Description 3.3V EDO DRAM
Datasheet download datasheet DP3ED32MX8RY5 Datasheet

Other Datasheets by Dense-Pac Microsystems

Part Number Description

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
M-Densus High Density Memory Device 256 Megabit CMOS 3.3V EDO DRAM DP3ED32MX8RY5 DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The module is constructed with four 8 Meg x 8 EDO, 3.3 Volt DRAM’s available in a 128 Megabit compatible pin-out. The 64 Megabit based M-Densus modules have been designed to fit in the same footprint as the 32 Meg x 4 DRAM TSOP monolithic. This allows the memory board designer to upgrade the memory in their products without redesigning the memory board, thus saving time and money. PIN-OUT DIAGRAM FEATURES: • Configurations Available: 256 Megabit: 32 Meg x 8 • Access Times: 50, 60ns (max.) • 3.