DPS128C32BV3
DESCRIPTION
: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches. The DPS128C32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for mercial, industrial and military applications. By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques. w w w
PIN-OUT DIAGRAM
- mercial only.
.D at
PIN NAMES
A0
- A16 I/O0
- I/O31 CE0
- CE3 WE0
- WE3 OE VDD VSS N.C. a S he
Address Inputs Data Input/Output Chip Enables Write Enables Output Enable Power (+5V) Ground No Connect
30A044-28 REV. F et
4U
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