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DPS128C32BV3 - 512kx8 High Speed CMOS SRAM

Download the DPS128C32BV3 datasheet PDF. This datasheet also covers the DPS128C32BV3_Dense variant, as both devices belong to the same 512kx8 high speed cmos sram family and are provided as variant models within a single manufacturer datasheet.

General Description

The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.

It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches.

Key Features

  • Organizations Available: 128K x 32, 256K x 16, or 512K x 8.
  • Access Times: 20, 25, 30, 35, 45ns.
  • Fully Static Operation - No clock or refresh required.
  • Single +5V Power Supply, ±10% Tolerance.
  • TTL Compatible.
  • Common Data Inputs and Outputs.
  • Low Data Retention Voltage: 2.0V min.
  • 66-Pin PGA ‘’VERSA-STACK’’ Package.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DPS128C32BV3_Dense-PacMicrosystems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number DPS128C32BV3
Manufacturer Dense-Pac Microsystems
File Size 512.94 KB
Description 512kx8 High Speed CMOS SRAM
Datasheet download datasheet DPS128C32BV3 Datasheet

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Other Datasheets by Dense-Pac Microsystems

Part Number Description
DPS128M8 128kx8 High Speed CMOS SRAM
DPS128M8xxx 128kx8 High Speed CMOS SRAM
DPS128X32BV3 128kx32 High Speed CMOS SRAM
DPS128X32CV3 128kx32 High Speed CMOS SRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches. The DPS128C32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications. By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques. w w w PIN-OUT DIAGRAM * Commercial only. .