DPS128C32BV3 Description
The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches. The DPS128C32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module...
DPS128C32BV3 Key Features
- Access Times: 20, 25, 30, 35, 45ns
- Fully Static Operation
- No clock or refresh required
- Single +5V Power Supply, ±10% Tolerance
- TTL patible
- mon Data Inputs and Outputs
- Low Data Retention Voltage: 2.0V min
- 66-Pin PGA ‘’VERSA-STACK’’ Package