DPS128C32BV3 - 512kx8 High Speed CMOS SRAM

This page provides the datasheet information for the DPS128C32BV3, a member of the DPS128C32BV3_Dense 512kx8 High Speed CMOS SRAM family.

Product Overview

Dense-Pac Microsystems

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Datasheet Details

Part number	DPS128C32BV3
Manufacturer	Dense-Pac Microsystems
File Size	512.94 KB
Description	512kx8 High Speed CMOS SRAM
Datasheet	DPS128C32BV3 Datasheet
Additional preview pages of the DPS128C32BV3 datasheet.

DPS128C32BV3 Product details

Description

The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.

It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches.

Features

Organizations Available: 128K x 32, 256K x 16, or 512K x 8.
Access Times: 20, 25, 30, 35, 45ns.
Fully Static Operation - No clock or refresh required.
Single +5V Power Supply, ±10% Tolerance.
TTL Compatible.
Common Data Inputs and Outputs.
Low Data Retention Voltage: 2.0V min.
66-Pin PGA ‘’VERSA-STACK’’ Package.

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Published: Dec 14, 2005 |