PDU620CT Datasheet | Diodes Incorporated

Features Mechanical Data - - - - - - - Case: Power DIä5 Case Material: Molded Plastic, “Green” Molding pound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminals: Finish - Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Polarity: See Diagram on Page 4 Marking: See Page 3 Weight: 0.096 grams (approximate) NEW PRODUCT - - - - - - - Glass Passivated Die Construction Ultra-Fast Recovery Time for High Efficiency High Maximum Junction Temperature High Forward Surge Current Capability Lead Free Finish, Ro HS pliant (Note 1) "Green" Molding pound (No Br, Sb) Qualified to AEC-Q101 Standards for High Reliability e3 TOP VIEW BOTTOM VIEW Maximum Ratings @ TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current (See also figure 4) per element total device Symbol VRRM VRWM VR VR(RMS) IO IFSM Value 200 141 3 6 90 Unit V V A A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave Superimposed on Rated Load per element Thermal Characteristics Characteristic Thermal Resistance Junction to Soldering Point Thermal Resistance Junction to Ambient Air (Note 2) Thermal Resistance Junction to Ambient Air (Note 3) Thermal Resistance Junction to Ambient Air (Note 4) Operating Temperature Range Storage Temperature Range Notes: 1. 2. 3. 4. Symbol Rq JS TA = 25°C TA = 25°C TA = 25°C Rq JA Rq JA Rq JA Tj TSTG Typ ¾ 80 65 45 Max 3.0 ¾ ¾ ¾ -65 to +175 -65 to +175 Unit °C/W °C/W °C/W °C/W °C °C Ro HS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. FR-4 PCB, 2 oz. Copper, minimum remended pad layout per http://.diodes./datasheets/ap02001.pdf. Polymide PCB, 2 oz. Copper, minimum remended pad layout per...