DDTC113TLP
Features
- Epitaxial Planar Die Construction
- Ultra-Small Leadless Surface Mount Package
- Ideally Suited for Automated Assembly Processes
- Totally Lead-Free & Fully Ro HS pliant (Notes 1 & 2)
- Halogen and Antimony Free. "Green" Device (Note 3)
- Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
- Case: X1-DFN1006-3
- Case Material: Molded Plastic. "Green” Molding pound.
UL Flammability Classification Rating 94V-0
- Moisture Sensitivity: Level 1 per J-STD-020
- Terminals: Finish
- Ni Pd Au
Solderable per MIL-STD-202, Method 208 e4
- Weight: 0.0009 grams (Approximate)
X1-DFN1006-3 Bottom View
Top View Pin-Out
B 10 KÙ
C3
E 2
Device Symbol
IN B
C OUT
E3
2 GND
Equivalent Inverter Circuit
Ordering Information (Note 4)
Product DDTC113TLP-7 DDTC113TLP-7B
Marking N4 N4
Reel size...
