DEMD48 Description
NEW.
DEMD48 Key Features
- Epitaxial Planar Die Construction
- Surface Mount Package Suited for Automated Assembly
- Simplifies Circuit Design and Reduces Board Space
- Lead Free/RoHS pliant (Note 1)
- "Green" Device (Note 2)
- Case: SOT-563
- Case Material: Molded Plastic, “Green” Molding pound. UL
- Moisture Sensitivity: Level 1 per J-STD-020C
- Terminals: Finish ⎯ Matte Tin Finish annealed over Copper
- Marking Information: See Page 4