Download DESD3V3S1BL Datasheet PDF
DESD3V3S1BL page 2
Page 2
DESD3V3S1BL page 3
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DESD3V3S1BL Key Features

  • Low Profile Package (0.53mm max) and Ultra-Small PCB Footprint Area (1.08
  • 0.68mm max) Suitable for pact Portable Electronics
  • Provides ESD Protection per IEC 61000-4-2 Standard: Air ±30kV, Contact ±25kV
  • 1 Channel of ESD Protection
  • Low Channel Input Capacitance
  • Typically Used in Cellular Handsets, Portable Electronics
  • Totally Lead-Free & Fully RoHS pliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Case: X1-DFN1006-2
  • Case Material: Molded Plastic, ―Green‖ Molding pound

DESD3V3S1BL Description

Features  Low Profile Package (0.53mm max) and Ultra-Small PCB Footprint Area (1.08 0.68mm max) Suitable for pact Portable Electronics  Provides ESD Protection per IEC 61000-4-2 Standard: Air ±30kV, Contact ±25kV  1 Channel of ESD Protection  Low Channel Input Capacitance  Typically Used in Cellular Handsets, Portable Electronics, munication Systems, puters and Peripherals  Totally Lead-Free & Fully RoHS...