KBP2005G
Key Features
- Glass Passivated Die Construction
- High Case Dielectric Strength of 1,500 VRMS
- Low Reverse Leakage Current
- Surge Overload Rating to 65A Peak
- Ideal for Printed Circuit Board Applications
- UL Listed Under Recognized ponent Index, File Number
- Lead-Free Finish; RoHS pliant (Notes 1 & 2)
- Case Material: Molded Plastic. UL Flammability Classification
- Moisture Sensitivity: Level 1 per J-STD-020
- Terminals: Finish – Tin Plated Leads. Solderable per MIL-STD
