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QSOP-20 - PACKAGE

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2 Mechanical Data  Surface Mount Package  Case Material: Molded Plastic, UL Flammability Rating 94V-0  Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 e3  Weight: 0.1286 grams (Approximate)  Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions QSOP-20 PACKAGE INFORMATION Top View D ZD E1/2 E1 QSOP-20 E/2 E h SEE DETAIL 'A' PIN 1 A A2 A1 e b h c 1(4x) 1 (4x) 2 R1 R  GAUGE PLANE SEATING PLANE L L2 L1 QSOP-20 Dim Min Max Typ A 1.55 1.73 - A1 0.10 0.25 - A2 1.40 1.50 - b 0.20 0.30 - c 0.18 0.25 - D 8.56 8.74 - E 5.79 6.20 - E1 3.81 3.99 - e 0.635 BSC h 0.254 0.508 - L 0.41 1.27 - L1 1.03 REF L2 0.254 BSC R 0.0762 - - R1 0.0762 - - ZD 1.