SOT123F
SOT123F is PACKAGE manufactured by Diodes Incorporated.
Mechanical Data
- Surface Mount Package
- Weight: 0.016grams (Approximate)
- Max Soldering Temperature 260°C for 30secs as per JEDEC
J-STD-020
- Polarity: Cathode Bar
- Case Material
- Molded Plastic, UL Flammability Rating 94V-0
- Terminals: Finish
- Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 e3
Package Outline Dimensions
Package View
SOD123F
E L2
PACKAGE INFORMATION
Top View b
He c
SOD123F Dim Min Max Typ
A 0.81 1.15 b 0.80 1.05 c 0.05 0.30 D 1.70 1.90 1.80 E 2.60 2.80 2.70 He 3.30 3.70 3.50 L2 0.35 0.85 All Dimensions in mm
Suggested Pad Layout
Note: Note:
SOD123F
Dimensions C G X X1 Y
Value (in mm) 2.86 1.52 1.34 4.20 1.80
X1
The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device Terminals and PCB tracking.
SOT23 Package Information
Rev. 2019-10-09
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