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UMG4N Description

NEW.

UMG4N Key Features

  • Epitaxial Planar Die Construction
  • Surface Mount Package Suited for Automated Assembly
  • Simplifies Circuit Design and Reduces Board Space
  • Lead Free/RoHS pliant (Note 1)
  • "Green" Device (Note 2)
  • Case: SOT-353
  • Case Material: Molded Plastic. UL Flammability
  • Moisture Sensitivity: Level 1 per J-STD-020C
  • Terminal Connections: See Diagram
  • Terminals: Finish