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DIOTEC ELECTRONICS CORP.
18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
Data Sheet No. BSBU-600-1C
FEATURES
MECHANICAL SPECIFICATION
SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 250 AMPS PEAK
w w w D .a t S h e e 4 t U c o .m
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS THRU-HOLE FOR EASY HEAT SINK MOUNTING
L
A1
UL RECOGNIZED - FILE #E124962
MECHANICAL DATA
L1 B1 B Case: Molded plastic, U/L Flammability Rating 94V-0
SYM A MILLIMETERS MIN 6.6 4.7 1.22 4.57 22.7 4.2 3.6 n/a 10.3 1.7 16.5 25.4 4.
SBU6J Datasheet
