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Data Sheet No. BDTC-800-1A
8 AMP SILICON BRIDGE RECTIFIERS
FEATURES MECHANICAL SPECIFICATION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
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SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 MILLIMETERS MIN 2.5 0.6 7.3 9.8 0.9 29.7 3.6 4.4 19.7 13.2 3.8 10.8 3.1 MAX 2.9 0.8 7.7 10.2 1.1 30.3 4.0 4.8 20.3 13.8 4.2 11.2 3.
DT8C00 Datasheet
