SDB4006 Datasheet | Diotec Semiconductor

FEATURES MECHANICAL SPECIFICATION SDB PACKAGE SHOWN ACTUAL SIZE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE INTEGRALLY MOLDED HEAT SINK PROVIDES VERY LOW THERMAL RESISTANCE FOR MAXIMUM HEAT TRANSFER SPACE SAVING IN-LINE DESIGN FOR PRINTED CIRCUIT BOARD APPLICATIONS Through Hole for #8 Screw BL AC + UL RECOGNIZED - FILE #E124962 Ro HS PLIANT HEAT SINK LM LL LD LO LS LS LS MECHANICAL DATA Case: Case: Molded epoxy with integral heat sink Epoxy carries a U/L Flammability rating of 94V-0 Terminals: Round silver plated copper pins or fast-on terminals Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case Mounting Position: Any. Through hole for #8 screw. Max. mounting torque = 20 in-lb. Weight: 0.55 Ounces (16.0 Grams) ÓHÔÂÕ ÖÄ× Ø»Ù ÚvÛ Ü Ü ÝvÞ ß6à á6â µ©¶ - v- v¶ µ©¸H¹H¸»º‚¼ Æ©Ç È ÌÎÍÄÏ Ž ’‘“” • ež6Ÿ   ˜™ d wtx y8zr{e| } ¬e­® ¯ ˆe‰ ‘ •8– — ’8“ ” ½ ¾À¿ÂÁÄÃ Å É©Ê Ë ÐÎÑÄÒ –8— –e˜š™8› ™eœ ¡6¢ £¡¤ e8f g - 6¦ - - - ©¨eª « °6± ²³´ hi j - 6… †‡- kl m t6u vew8x€y‚H- no p8n8nrqtsvu ~6 €e8‚€- ‚- H… †6‡ ˆ‰r- e‹vŒ MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS  ¢¡ £ ¤ - - ¦©¨¡ £ ¡© ¤ !- £©£ !- "- !©# ¡ £ $# !$- ©% ! ¨- ¨&- £ '- !©# (¤ ¨ !¨©"- !- )- ¤ 0 ¤ !- 132 45¤ - ©¦% !6"©'- ¡ ¨- !©7 '- ¡©% 0©(8¡ 9 !7 @ A©BDC 7 # ! ¨¤ ¨- £ ¤ 9- !&3#3¤ - ©1$©) £ ¤ 9 !6% &- ¡©12 E©&3#) ¡" ¡- )- ¤ £ ¤ 9 !6% &©¡- 1©¨7 1- !# ¡ £ !)©$©# # !©- - £3 F6 A GH2 PARAMETER (TEST CONDITIONS) Series Number Maximum DC Blocking Voltage Maximum RMS Voltage Maximum Peak Recurrent Reverse Voltage Average Forward Rectified Current @ T = 55 C Peak Forward Surge Current. Single 60Hz Half-Sine Wave í î Superimposed on Rated Load (JEDEC Method). T = 175 C Forward Voltage (Per Diode) at 20 Amps DC Maximum Average DC Reverse Current At Rated DC Blocking Voltage Typical Thermal Resistance,...