Diotec Semiconductor ADB3508P
35 AMP SILICON BRIDGE RECTIFIERS
FEATURES
MECHANICAL SPECIFICATION SERIES: DB3500P - DB3510P and ADB3504P - ADB3508P VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE INTEGRALLY MOLDED HEAT SINK PROVIDES VERY LOW THERMAL RESISTANCE FOR MAXIMUM HEAT DISSIPATION BH Ø Ù¢ÚEÛTÜ Ý Þbß BH ë ì3í î§ï©î ð¢ì î§ñ LT LL ä å3æ ç§è©ç é¢å ç§ê D1 HOLE FOR #8 SCREW Ê Ë§Ì¢Í§Î Ï ÐeË Ñ Ò Ï Ó Ô Õ§Î Ö × HOLE FOR #8 SCREW LD UL RECOGNIZED - FILE #E141956 + öT÷ D1 D3 BL à¢á â¢ã + _ òTó BL D1 + ôTõ D2 RoHS COMPLIANTMECHANICAL DATA
øTù _ D2 _ Case: Case: Molded epoxy with integral heat sink Epoxy carries a U/L Flammability rating of 94V-0 Terminals: Round silver plated copper pins or fast-on terminals Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case Mounting Position: Any. Through hole for #8 screw. Max. mounting torque = 20 in-lb. Weight: Fast-on Termi...