Diotec Semiconductor GP104
1 AMP HIGH RELIABILITY SILICON DIODES
FEATURES
MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) ACTUAL SIZE OF DO-41 PACKAGE SERIES GP100 - GP110 DO - 41 LL BD (Dia) EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 1A at TA = 75 C WITH NO THERMAL RUNAWAYMECHANICAL DATA
LL Case: JEDEC DO-41, molded epoxy (U/L Flammability Rating 94V-0) Terminals: Plated axial leads Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Color band denotes cathode Mounting Position: Any Weight: 0.012 Ounces (0.34 Grams) LD (Dia) ¤ BL Color Band Denotes Cathode S RoH LI MP O C ANT Sym BL BD LL LD Minimum In mm 0.160 0.103 1.00 0.028 4.1 2.6 25.4 0.71 Maximum In mm 5.2 0.205 0.107 0.034 2.7 0.86MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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