FEATURES
MECHANICAL SPECIFICATION Suggested Alternative For MR2400F, MR2401F, MR2404F, and MR2406F True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot C D5 D3 A fP HIGH Frequency: 250 kHz FAST Recovery: 100nS - 150nS D1 Unmatched Performance - Minimal RFI/EMI, D Reduced Power Losses, Extremely Cool Operation Increased Power Supply Efficiency D4 B1 VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL DATA
D2 B2 12 B B3 A1 Structure: Epoxy encapsulated diode body with metal tabs Finish: All external surfaces are corrosion resistant and PIN 1 CATHODE PIN 2 ANODE readily solderable Maximum Soldering Temperature: 250
Diotec Semiconductor