FEATURES
SUGGESTED REPLACEMENT FOR MR820, MR821 MR822, MR824, MR826 DIODES HIGH FREQUENCY: 250 kHz FAST RECOVERY: Typical 100nS - 150nS UNMATCHED PERFORMANCE - Minimal RFI/EMI, Reduced Power Losses, Extremely Cool Operation Increased Power Supply Efficiency VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Proprietary Junction Passivation For Superior Reliability and Performance Wide Range of APPLICATIONS
- Inverters, Converters Choppers, Power Supplies, etc. M MECHANICAL DATA
Case: Molded Epoxy (UL Flammability Rating 94V-O) Finish: All external surfaces are corrosion resistant and the contact areas are readily solderable Maximum Lead Soldering Temperature: 210 oC, 3/8" case for 10 seconds at 5 lbs tension Mounting Position: Any Polarity: Color band or diode symbol on case Weight: 0.09 Ounces (2.5 Grams) MECHANICAL SPECIFICATION DA E L FB Die Size: 0.180" x 0.180" Square MILLIMETERS INCHES DIM MIN M...
Diotec Semiconductor