RGP108 Datasheet PDF

FEATURES

MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) ACTUAL SIZE OF DO-41 PACKAGE SERIES RGP100 - RGP110 DO - 41 LL BD (Dia) EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 1A at TA = 75 C WITH NO THERMAL RUNAWAY

MECHANICAL DATA

LL Case: JEDEC DO-41, molded epoxy (U/L Flammability Rating 94V-0) Terminals: Plated axial leads Soldering: Per MIL-STD 202E Method 208 guaranteed Polarity: Color band denotes cathode Mounting Position: Any Weight: 0.012 Ounces (0.34 Grams) LD (Dia) & BL Color Band Denotes Cathode S RoH CO LI MP ANT Sym BL BD LL LD Minimum In mm 0.160 0.103 1.00 0.028 4.1 2.6 25.4 0.71 Maximum In mm 5.2 0.205 0.107 0.034 2.7 0.86

MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS

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