Diotec Semiconductor RGP202
2 AMP FAST RECOVERY SILICON DIODES
FEATURES
MECHANICAL SPECIFICATION PROPRIETARY SOFT GLASS R JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE ACTUAL SIZE OF DO-41 PACKAGE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) SERIES RGP200 - RGP210 DO - 41 BD (Dia) LL EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 2A at T¡ = 75 ¢ C WITH NO THERMAL RUNAWAYMECHANICAL DATA
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