RGP308 Datasheet PDF

FEATURES

MECHANICAL SPECIFICATION PROPRIETARY SOFT GLASS R JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE ACTUAL SIZE OF DO-27 PACKAGE DO - 27 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) SERIES RGP300 - RGP310 BD (Dia) LL EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 3A at T­ = 55 ® C WITH NO THERMAL RUNAWAY

MECHANICAL DATA

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