SB500 Datasheet PDF

FEATURES

MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK IDEAL FOR PRINTED CIRCUIT BOARD

APPLICATIONS

SB5 PACKAGE SHOWN ACTUAL SIZE C C1 SB506 D1 + 712 AC _ A D RELIABLE LOW-COST MOLDED PLASTIC CONSTRUCTION L RoHS COMPLIANT

MECHANICAL DATA

Case: Molded Epoxy (UL Flammability Rating 94V-0) Terminals: Round silver plated pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on case Mounting Position: Any Weight: 0.38 Ounces (10.6 Grams) B2 ç è˜éfêhëHì × ØfÙ MÚ IÛfLLÜ IMETERS Ý6Þhßáà­âhã ä­åhæ ª 6ž Ÿ 6¡ ¢ £ «­¬ ˆ6‰ Š ‹ ® 8Ž   ¯f° ¤6¥ ¦ §6¨ © § § ±³² „u 6† ‡ ~ ‘ ’6“ ’ ƒ‚ ”V• – Œ ÇVÈ8É Ê Ë6Ì Í Î Î f€ ÓVÔ8Õ Ö Ï6Ð Ñ Ò Ï — ˜ ™6š › œ ´ µV¶
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MAXIMUM RATINGS

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