SBU4M Datasheet PDF

FEATURES

MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK IDEAL FOR PRINTED CIRCUIT BOARD

APPLICATIONS

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MECHANICAL DATA

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