SBU6M Datasheet PDF

FEATURES

MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 250 AMPS PEAK w w w D .a t S h e e 4 t U c o .m IDEAL FOR PRINTED CIRCUIT BOARD

APPLICATIONS

THRU-HOLE FOR EASY HEAT SINK MOUNTING L A1 UL RECOGNIZED - FILE #E124962

MECHANICAL DATA

L1 B1 B Case: Molded plastic, U/L Flammability Rating 94V-0 SYM A MILLIMETERS MIN 6.6 4.7 1.22 4.57 22.7 4.2 3.6 n/a 10.3 1.7 16.5 25.4 4.57 MAX 7.1 5.2 1.32 5.59 23.24 4.7 4.1 19.3 11.3 2.2 17.8 n/a 6.8 INCHES MIN 0.260 0.185 0.048 0.180 0.895 0.165 0.140 n/a 0.405 0.065 0.660 1.0 0.180 MAX 0.280 0.205 0.052 0.220 0.915 0.185 0.160 0.760 0.455 0.085 0.700 n/a 0.260 Terminals: Round silver plated pins A1 B B1 C C1 C2 D D1 D2 D3 L L1 Soldering: Per MIL-STD 202 Method 208 guaranteed _ + Polarity: Marked on case Mounting Position: Any.