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FMN4ST4DCF-25IH - 1.8V NAND Flash Memory and Mobile DDR2

Key Features

  • Operating Temperature Range - Industrial Part : - 40°C ~ 85°C.
  • Package Type : - 162-ball FBGA, 8x10.5mm2, 1.1T, 0.5mm Ball Pitch - Lead & Halogen Free.
  • NAND.
  • Architecture (4G bits) - Input / Output Bus Width: 8-bits / 16-bits - Page size X8 : (4K+256spare) bytes (@1.8V) X16 : (2K+128spare) words (@1.8V) - Block size X8 : (256K+16K) bytes X16 : (128K+8K) words - Plane Size: 2048 Blocks - Device Size: 1 Plane per Device.
  • Page Read / Program - Random Rea.

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Datasheet Details

Part number FMN4ST4DCF-25IH
Manufacturer Dosilicon
File Size 6.32 MB
Description 1.8V NAND Flash Memory and Mobile DDR2
Datasheet download datasheet FMN4ST4DCF-25IH Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FMN4xT4DCF-25Ix FMN4xT4DCF-25IH Datasheet • Do not leave this document unattended. • This information contained in this document covered by the non-discloser agreement. • Do not reproduce this document. • This document is property of Dosilicon Co., Ltd. and maybe be required to be returned at any time. Rev. 0.1 Feb. ‘20 Dosilicon Co., Ltd. 1 Document Title Stacked Multi-Chip Product (NAND=4Gb, LPDDR2=2*2Gb) Revision History Revision No. History 0.0 Initial Draft 0.1 Production Release for dimension 1.1mm thickness FMN4xT4DCF-25Ix Draft date Mar., 2019 Feb., 2020 Remark Rev. 0.1 Feb. ‘20 2 FMN4xT4DCF-25Ix Stacked Multi-Chip Product(MCP) 1.8V NAND Flash Memory and Mobile DDR2 1.