AN4839 - Power Assemblies

Dynex Semiconductor

Datasheet Details

Part number	AN4839
Manufacturer	Dynex Semiconductor
File Size	114.74 KB
Description	Power Assemblies
Datasheet	AN4839 Datasheet
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Full PDF Text Transcription

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Heatsinks HEATSINKS Power Assemblies DS5404-1.0 November 2000 The current range of heatsinks is illustrated with a brief resumé of their characteristics. The products available are intended for use with all our power semiconductors - from the small stud base through to large disc devices and modules. All heatsinks are suitable for Natural Air Cooling (AN) and Forced Air Cooling (FC). In addition to a vast experience of AN and FC cooling methods we also have many years experience in liquid and phase change cooling. A range of coolers for 17mm to 100mm silicon diameter devices is available, as is a range of associated clamps. AIR COOLED HEATSINKS All dimensions shown in mm unless stated otherwise. THERMAL RESISTANCE (˚C/W) 0.5 0.48 0.46 0.44 0.42 0.4 0.38 0.36 0.34 200W 0.

Published: Mar 26, 2005 |