The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
Heatsinks
HEATSINKS
Power Assemblies
DS5404-1.0 November 2000
The current range of heatsinks is illustrated with a brief resumé of their characteristics. The products available are intended for use with all our power semiconductors - from the small stud base through to large disc devices and modules.
All heatsinks are suitable for Natural Air Cooling (AN) and Forced Air Cooling (FC). In addition to a vast experience of AN and FC cooling methods we also have many years experience in liquid and phase change cooling.
A range of coolers for 17mm to 100mm silicon diameter devices is available, as is a range of associated clamps.
AIR COOLED HEATSINKS
All dimensions shown in mm unless stated otherwise.
THERMAL RESISTANCE (˚C/W)
0.5
0.48
0.46
0.44
0.42
0.4
0.38
0.36 0.34
200W
0.