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DIM200PHM33-A000 - Half Bridge Igbt Module

Key Features

  • I I I I KEY.

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Datasheet Details

Part number DIM200PHM33-A000
Manufacturer Dynex Semiconductor
File Size 223.68 KB
Description Half Bridge Igbt Module
Datasheet download datasheet DIM200PHM33-A000 Datasheet

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www.DataSheet4U.com DIM200PHM33-A000 DIM200PHM33-A000 Half Bridge IGBT Module Replaces November 2002, version DS5464-6.2 DS5464-7.1 January 2003 FEATURES I I I I KEY PARAMETERS VCES VCE(sat) * IC IC(PK) (typ) (max) (max) 3300V 3.4V 200A 400A 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates *(measured at the power busbars and not the auxiliary terminals) APPLICATIONS I I I 1(E1/C2) 2(C1) 5(E1) 4(G1) 3(E2) 7(E2) 6(G2) High Reliability Inverters Motor Controllers Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 2400A.