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DIM400XCM33-F000 - IGBT Chopper Module

Key Features

  • Soft Punch Through Silicon Isolated MMC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction High Isolation module KEY.

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Datasheet Details

Part number DIM400XCM33-F000
Manufacturer Dynex Semiconductor
File Size 343.38 KB
Description IGBT Chopper Module
Datasheet download datasheet DIM400XCM33-F000 Datasheet

Full PDF Text Transcription for DIM400XCM33-F000 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for DIM400XCM33-F000. For precise diagrams, and layout, please refer to the original PDF.

www.DataSheet4U.com DIM400XCM33-F000 IGBT Chopper Module DS5938-1.0 February 2009(LN26594) FEATURES Soft Punch Through Silicon Isolated MMC Base with AlN Substrates High ...

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Soft Punch Through Silicon Isolated MMC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction High Isolation module KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) *(measured at the auxiliary terminals) 3300V 2.8 V 400A 800A APPLICATIONS High Reliability Inverters Motor Controllers Traction Drives Choppers The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 3600A.

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