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DIM250KHM33-TS001 - Half Bridge IGBT Module

Key Features

  • 10µs Short Circuit Withstand.
  • High Thermal Cycling Capability.
  • High Current Density Enhanced DMOS SPT.
  • Isolated AlSiC Base with AlN Substrates.
  • Lead Free Construction KEY.

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Datasheet Details

Part number DIM250KHM33-TS001
Manufacturer Dynex
File Size 347.59 KB
Description Half Bridge IGBT Module
Datasheet download datasheet DIM250KHM33-TS001 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Replaces DS6391-5 DIM250KHM33-TS001 Half Bridge IGBT Module DS6391-6 April 2024 (LN43308) FEATURES • 10µs Short Circuit Withstand • High Thermal Cycling Capability • High Current Density Enhanced DMOS SPT • Isolated AlSiC Base with AlN Substrates • Lead Free Construction KEY PARAMETERS VCES VCE(sat) * (typ) IC (max) IC(PK) (max) 3300V 2.2V 250A 500A * Measured at the auxiliary terminals APPLICATIONS • High Reliability Inverters • Motor Controllers • Traction Auxiliaries • Choppers The Powerline range of high-power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A.