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Technical Data 4336
Effective January 2019 Supersedes May 2017
0603FA
Fast-acting Chip™ surface mount fuse
HALOGEN
HF
FREE
Pb
Surface Mount Device
Product features • AEC-Q200 qualified • Fast-acting surface-mount fuse • Satisfies the EIA/IS-722 standard • Solder immersion compatible Agency information • UL Recognition Guide & File numbers: JDYX2
&E19180 • CSA Component Acceptance: 053787 C 000 &
Class Number: 1422 30
Soldering method • Wave immersion: +260 °C, 10 seconds maximum • Infrared reflow: +260 °C, 30 seconds maximum
Environmental data • Operating temperature: -55 ºC to +125 ºC with
proper derating • Load humidity test: MIL-STD-202, Method 103B • Moisture resistance test: MIL-STD-202, Method
106E • Thermal shock test: MIL-STD-202, Method 107D • High frequency vibration test: