EATON 3216FF
Fast-acting Chip surface mount fuse
| Part No. | 3216FF |
|---|---|
| Datasheet | 3216FF Download |
| Manufacturer |  EATON |
| Description | Fast-acting Chip surface mount fuse |
| Buy | Stock & Price |
Technical Data 3001 Effective October 2017 Supersedes May 2017 3216FF Fast-acting Chip™ surface mount fuse HALOGEN HF FREE Pb Environmental data Product features
● AEC-Q200 qualified (250 mA to 7 A)
● Fast-acting surface mount fuse
● Ratings up to 30 amps
● Excellent temperature and cycling characteristics
● Compatible with reflow and wave solder Agency information
● UL Recognition Guide JDYX2 & File E19180.
● CSA Component Acceptance: 053787 C 000 & Class No: 1422 30.
● cURus Recognition File: E19180, Guide JDYX2/ JDYX8 Soldering method
●
● Wave Immersion: 260 °C, 10 sec max. Infrared Reflow: 260 °C, 30 sec max.
● Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 °C to +125 °C)
● Vibration: MIL-STD-202, Method 204, Test Condition C (55 Hz - 2 kHz, 10 G)
● Moisture Resistance: MIL-STD-202, Method 106,10 day cycle
● Solderability: ANSI/J-STD-002, Test B
● Additional resistance to solder heat test: MIL- STD-202G Method 210F Condit
● AEC-Q200 qualified (250 mA to 7 A)
● Fast-acting surface mount fuse
● Ratings up to 30 amps
● Excellent temperature and cycling characteristics
● Compatible with reflow and wave solder Agency information
● UL Recognition Guide JDYX2 & File E19180.
● CSA Component Acceptance: 053787 C 000 & Class No: 1422 30.
● cURus Recognition File: E19180, Guide JDYX2/ JDYX8 Soldering method
●
● Wave Immersion: 260 °C, 10 sec max. Infrared Reflow: 260 °C, 30 sec max.
● Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 °C to +125 °C)
● Vibration: MIL-STD-202, Method 204, Test Condition C (55 Hz - 2 kHz, 10 G)
● Moisture Resistance: MIL-STD-202, Method 106,10 day cycle
● Solderability: ANSI/J-STD-002, Test B
● Additional resistance to solder heat test: MIL- STD-202G Method 210F Condit
